Shaanxi Brother Affection Merchandise Co. Ltd

Model Number: Electronic Assembly-1-1-1-1-1 Brand Name: BAM Key Specifications/Special Features: Material: rigid and flexible PCBBoard thickness: 0.6 to 3mmSurface: gold plating and immersion goldLayers: 2 to 16Blind and buried

High TG and frequency

Lead-free

Twist and warp: <1% 0.1mm on integrated circuit parts with SO, SOP, SOJ, TSSOP, QFP and BGA SMT: 0201, 0402, 0603, 0805, 1008, 1206 and 1210

Dip pitches through hole down to 0.60mm

Solder components to underside of board without disrupting topside Inspection inline for QOI and ICT testing inline

X-ray inspection for BGA

Maximum panel size: 550x660mm

Minimum hole diameter: 0.35mm

Minimum line width and space: 0.1mm

OEM/ODM services are welcome

High-precision e-testing includes ICT inline, function test, full experienced QC and QA engineer

RoHS Directive-compliant